Development of Array Format Ceramic Csp

摘要

Kyocera has developed packaging technology for CSP utilizing array format substrate with optimized ceramic carrier and liquid encapsulant and with maximum utilization of equipment designed for PBGA and PQFP assembly. Since it was confirmed through the evaluation that material properties of encapsulant affect to 2nd level (package to printed wiring board) reliability, the encapsulant was developed to secure both for 1st (package) and 2nd level reliability. Score lines on ceramic substrate enable singulation process by snapping without dicing / sawing operation.