PURPOSE: A method of manufacturing an area array chip is to simplify steps of manufacturing the package without deteriorating of thermal and electrical characteristics. CONSTITUTION: A manufacturing a semiconductor package comprises steps of; attaching a semiconductor chip(3) to a metal substrate by using an epoxy; attaching an organic material, which is soluble in water or chemical solvent on an input/output terminal of semiconductor chip; molding the semiconductor using an epoxy molding compound(4) to protect a chip; removing the organic material from the molded surface; forming an input/output terminal(5) on a position, where the organic material is removed, by using a process of solder dipping, reflow soldering, or solder paste printing.
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