Reliability of ball grid arrays was assessed as part of a consortium effort led by the Jet Propulsion Laboratory. Nearly 200 test vehicles, each with four packages, were assembled and tested using an experiment design. The most critical variables incorporated for the experiment were package types, ceramic and plastic; board materials, FR-4 and polyimide; surface finishes, OSP, HASL, and Ni/Au; solder volumes, low, standard, and high; and environmental conditions. This paper presents the most current thermal cycling test results (6000 cycles) for plastic OMPAC and SuperBGA packages with 352 I/Os and 560 I/Os. Failure mechanisms detected by electrical continuity interruptions as well as optical and scanning electron microscopy results will also be compared for ceramic and plastic package assemblies.
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机译：作为由喷射推进实验室领导的联盟努力的一部分，评估了球栅阵列的可靠性。使用实验设计组装和测试了近200个测试车辆，每个测试车辆都有四个包装。包含用于实验的最关键的变量是包装类型，陶瓷和塑料;板材，FR-4和聚酰亚胺;表面处理，OSP，HASL和NI / AU;焊料量，低，标准和高;和环境条件。本文介绍了塑料OMPac和SuperBga封装的最新热循环试验结果（<6000个循环），具有352 I / O和560 I / O.通过电连续性中断检测的故障机制以及光学和扫描电子显微镜结果也将与陶瓷和塑料包装组件进行比较。
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