X-ray diffraction analysis of microstructure formation in electrodeposits

摘要

Advantages of X-ray diffraction methods concerning the structural characterization of electrodeposits are demonstrated in connection with three problems occurring at investigations of Cu-coatings deposited at various conditions (electrolytes, temperatures, current densities) onto different substrates: development of microstructure and stress in dependence on deposit thickness, substructure-hardness correlation, and stability of the as-deposited coating.