Electroless copper plating on alumina ceramic

摘要

Electroless copper plating was carried out on alumina substrate. The Al_2O_3 substrates were etched under different conditions to study the correlation between the adhesion strength and the surface morphology of Al_2O_3 ceramic. It was confirmed that ceramic surface roughness and mechanical interlocking are two major causes promoting the adhesion. Molten NaOH etching, producing the combination of roughening and interlocking, could reach the greatest copper-to-ceramic adhesion with 20Mpa. Cu conductor pattern with high adhesion was selectively formed on the alumina substrate.