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An experimental investigation of the emissivity of various electronic packages

机译:各种电子包装发射率的实验研究

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The radiation emissivities for quad flat pack, ball grid array, metal quad flat pack, and exposed heat slug packages were measured by an infrared pyrometer and a Gier Dunkle infrared reflectometer. Emissivities were also calculated from experiments done in an evacuated bell jar. Experiments were performed to measure an effective emissivity from the entire package and to determine the local emissivity at a specific location on the package. The results indicate that effective emissivities from the entire package range from 0.91 for regular quad flat packs to 0.28 for the exposed heat slug packages. Local emissivities measured were strongly dependent upon the amount of marking ink on the surface of the package. The measured emissivity of the nickel surface of the exposed heat slug was 0.15 when marked with black ink and 0.04 without the marking ink.
机译:通过红外高温计和Gier Duledle红外反射计测量四边形扁平包装,球栅阵列,金属四扁平包装和暴露的热块封装的辐射发射率。还根据在抽空的钟罩中完成的实验计算发射率。进行实验以测量整个包装的有效发射率,并确定包装上特定位置的局部发射率。结果表明,对于暴露的热夹封装,整个包装的有效发射率为0.91的常规四边形包装至0.28。测量的局部发射率强烈依赖于包装表面上的标记墨水的量。当用黑色油墨标记为0.15时,裸露的热块的镍表面的测量率为0.15,没有标记油墨。

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