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Threshold voltage degradation in plasma damaged cmos transistors - role of electron and hole traps related to charging damage

机译:等离子体损坏的CMOS晶体管阈值电压劣化 - 电子和孔陷阱与充电损坏的作用

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The paper presents results of study of threshold voltage (VT) degradation in CMOS transistors damaged by high-field charging. Fowler-Nordheim stress induced VT degradation in devices with latent charging damage due to plasma processing was found to be strongly dependent on device type and diagnostic stress conditions. "Direct" and "reverse" antenna effect for NMOS, and anomalous behavior of PMOS devices are explained with polarity dependent trapping and the model includes generation of hole traps, an effect not considered previously.
机译:本文提出了通过高场充电损坏的CMOS晶体管中阈值电压(VT)劣化研究的结果。 Fowler-Nordheim应力在具有等离子体处理引起的潜在充电损坏的装置中诱导VT劣化,这被发现强烈依赖于器件类型和诊断应力条件。对于NMOS的“直接”和“反向”天线效应以及PMOS器件的异常行为,具有极性相关的捕获,并且模型包括产生孔陷阱,以前不考虑的效果。

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