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Low temperature grown Be-doped InAlP band offset reduction layer to p-type ZnSe

机译:低温生长被掺杂的INALP带偏移减速层至p型ZnSE

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To solve the difficulty of achieving a low resistance ohmic contact to p-type ZnSe, the use of an intermediate p-type InAlP layer to p-type ZnSe as a valence band offset reduction layer is studied by gas source MBE (molecular beam epitaxy). It is found that the surface morphology of the In/sub 0.5/Al/sub 0.5/P layers grown on [001] ZnSe becomes better as the growth temperature is decreased. The further use of the group III-flux modulated growth method produces a better surface morphology. It is found that the hole concentrations as high as 2/spl times/10/sup 18/ cm/sup -3/ are easily obtained for p-type InAlP layers grown even at low temperature of 350/spl deg/C, although a higher Be cell temperature is required than that for a 500/spl deg/C grown p-type InAlP due to decreased electrical activity of Be in InAlP. Despite the very high Be concentrations, the Be precipitation/segregation is not observed. These results suggest that the Be-doped InAlP layer can be used as an intermediate layer to form the low resistance ohmic contact to p-type ZnSe.
机译:为了解决难以实现低电阻欧姆接触的p型ZnSe,通过气源MBE(分子束外延)研究了作为价带偏移减压层的中间p型Inalp层与p型znse的使用。结果发现,随着生长温度降低,在ZnSe上生长的/亚/级/亚/亚0.5 / p系数的表面形态变得更好。 III-FORUX调制生长方法的进一步使用产生更好的表面形态。结果发现,即使在350 / SPL DEG / C的低温下也可以容易地获得高达2 / SPL时间/ 10 / SOP 18 / cm / sup -3 /易于生长的孔浓度。由于在InAlp中的电气活度降低,需要比细胞温度更高,而不是500 / SPL DEG / C生长的p型Inalp。尽管浓度非常高,但不观察到沉淀/隔离。这些结果表明,掺杂的Inalp层可以用作中间层,以形成对P型ZnSE的低电阻欧姆接触。

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