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Drop reliability study of PBGA assemblies with SAC305, SAC105 and SAC105-Ni solder ball on Cu-OSP and ENIG surface finish

机译：用SAC305，SAC105和SAC105-Ni焊球对PBGA组件的降低可靠性研究Cu-OSP和ENIG表面光洁度

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Lead free SnAgCu solder joints used in surface mount packages like Ball Grid Array (BGA) have a great impact on the reliability of the end product. The mechanical properties of the solder are important factors. By changing the concentration of silver and

机译：在表面贴装包装中使用的无铅SnAGCU焊点，如球栅阵列（BGA）对最终产品的可靠性产生了很大的影响。焊料的机械性能是重要因素。通过改变银的浓度和

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来源
《Electronic Components and Technology Conference》|2008年||共6页
会议地点
作者
Zhu W.H.; Luhua Xu; Pang J.H.L.; Zhang X.R.; Poh E.; Sun Y.F.; Sun A.Y.S.; Wang C.K.; Tan H.B.;
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原文格式 PDF
正文语种
中图分类 TN6-53;
关键词
assembling; ball grid arrays; integrated circuit packaging; integrated circuit reliability; solders; surface finishing; PBGA Assemblies; ball grid array; drop reliability; impact reliability; solder ball; solder joints; surface finish; surface mount packages;

机译：组装;球栅阵列;集成电路包装;集成电路可靠性;焊料;表面精加工;PBGA组件;球栅阵列;降低可靠性;影响可靠性;焊球;焊点;表面饰面;表面装载封装;

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专利

1. Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test [J] . Myung Woo-Ram, Kim Yongil, Kim Kyung-Yeol, Journal of Electronic Materials . 2016,第7期

机译：在温度和湿度测试下，具有ENIG和ENEPIG表面光洁度的含环氧树脂的Sn-58 wt。％Bi焊点的跌落可靠性
2. Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint [J] . Sang-Su Ha, Jongwoo Park, Seung-Boo Jung Materials transactions . 2011,第8期

机译：ENIG表面光洁度中添加Pd对Sn-Ag-Cu焊点跌落可靠性的影响
3. Phase identification and interface evolution of ENIG/Cu-core SAC305/ ENIG solder joints after the thermal-electrical coupling reliability test [J] . Fleshman Collin, Song Rui-Wen, Tsai Su-Yueh, Materials Letters . 2020,第Sepa15期

机译：热电耦合可靠性试验后ENIG / CU-COSE SAC305 / ENIG焊点的相位识别和界面演化
4. Drop reliability study of PBGA assemblies with SAC305, SAC105 and SAC105-Ni solder ball on Cu-OSP and ENIG surface finish [C] . Zhu W.H., Luhua Xu, Pang J.H.L., Electronic Components and Technology Conference . 2008

机译：用SAC305，SAC105和SAC105-Ni焊球对PBGA组件的降低可靠性研究Cu-OSP和ENIG表面光洁度
5. Solder joint reliability of plastic ball grid array (PBGA) and bottom-leaded plastic (BLP) assemblies. [D] . Zhang, Xiaowu. 1999

机译：塑料球栅阵列（PBGA）和底铅塑料（BLP）组件的焊点可靠性。
6. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [O] . Mohd Nizam Ab. Rahman, Noor Suhana Mohd Zubir, Raden Achmad Chairdino Leuveano, 2014

机译：锡膏合金的可靠性研究以改善表面安装细间距元件的焊点
7. An Investigation of the Solder Ball Reliability for a Thermally Enhanced FC-PBGA Assembly [O] . 家帆林 2014

机译：热增强FC-PBGA组件焊球可靠性研究

Drop reliability study of PBGA assemblies with SAC305, SAC105 and SAC105-Ni solder ball on Cu-OSP and ENIG surface finish

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