Multi-chip integrated high-power white LED device on the multi-layer ceramic substrate

机译：多层陶瓷基板上的多芯片集成大功率白色LED器件

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摘要

In order to solve the thermal issue and improve the thermal resistance of LED, a device with multi-chip packaged on multi-layer composite ceramic substrate is successfully packaged. The top layer of the substrate is low temperature co-fire ceramic (LTCC),

机译：为了解决热问题并提高LED的热阻，成功包装了在多层复合陶瓷基板上具有多芯片的多芯片的装置。基板的顶层是低温共火陶瓷（LTCC），

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来源
《Electronic Components and Technology Conference》|2008年||共5页
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作者
Luqiao Yin; Weiqiao Yang; Yansheng Guo; Kejun Ma; Shuzhi Li; Mingfa Chen; Jia Li; Jianhua Zhang;
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原文格式 PDF
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中图分类 TN6-53;
关键词
aluminium; aluminium compounds; ceramic packaging; light emitting diodes; multichip modules; photoelectricity; thermal conductivity; AlNlt; subgt; xlt; /subgt; AlOlt; subgt; xlt; /subgt; adhesive layer; alumina substrate; aluminum nitride; aluminum substrate; convection coefficient; heat;

机译：铝化合物;陶瓷包装;发光二极管;多芯片模块;光电;导热性;α＆lt;x＆lt;x＆lt;x＆lt;x＆lt;x＆lt;x＆lt;x＆lt;x＆lt;x＆lt;x＆lt;铝基衬底;氧化铝;氮化铝;氮化铝;氮化铝;铝基质;对流系数;热量;

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专利

1. Tunable blue/yellow emission in high-power white LED devices packaged with Ce:(Y, Gd)AG transparent ceramics [J] . Shao Cen, Zhang Le, Zhou Tianyuan, CERAMICS INTERNATIONAL . 2019,第11期

机译：高功率白色LED设备中的可调蓝色/黄色排放，配有CE：（Y，GD）AG透明陶瓷
2. Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package [J] . C.T. Yang, W.C. Liu, C.Y. Liu Microelectronics & Reliability . 2012,第5期

机译：大功率多芯片LED封装中使用的一级Cu基板的热阻测量
3. Thermal design and analysis of multi-chip LED module with ceramic substrate [J] . Luqiao Yin, Lianqiao Yang, Weiqiao Yang, Solid-State Electronics . 2010,第12期

机译：陶瓷基板多芯片LED模块的热设计与分析
4. Multi-chip integrated high-power white LED device on the multi-layer ceramic substrate [C] . Luqiao Yin, Weiqiao Yang, Yansheng Guo, Electronic Components and Technology Conference . 2008

机译：多层陶瓷基板上的多芯片集成大功率白色LED器件
5. Epitaxial growth and characterization of 4H-silicon carbide on low off-axis substrates for high-power devices. [D] . Shrivastava, Amitesh. 2008

机译：高功率器件的低轴外衬底上4H碳化硅的外延生长和表征。
6. Theoretical predicted high-thermal-conductivity cubic Si3N4 and Ge3N4: promising substrate materials for high-power electronic devices [O] . Huimin Xiang, Zhihai Feng, Zhongping Li, -1

机译：理论预测的高导热立方晶Si3N4和Ge3N4：大功率电子设备的有前途的衬底材料
7. Efficient Spectral Regulation in Ce:Lu3(Al,Cr)5O12 and Ce:Lu3(Al,Cr)5O12/Ce:Y3Al5O12 Transparent Ceramics With High Color Rendering Index for High-Power White LEDs/LDs [O] . Tianyuan Zhou, Chen Hou, Le Zhang, 2021

机译：CE：Lu3（Al，Cr）5012和Ce：Lu3（Al，Cr）5012 / Ce：Y3Al5O12：Y3Al5O12透明陶瓷，具有高色白色LED / LD的高色渲染指数
8. Study of Bonding Methods of Aluminum Beam Leaded Devices on Microcircuit Ceramic Substrates [R] . 1973

机译：微电路陶瓷基板上铝带引线器件的粘接方法研究

Multi-chip integrated high-power white LED device on the multi-layer ceramic substrate

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