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Universal mobility-field curves for electrons and holes in MOS inversion layers

机译:MOS反转层中电子和孔的通用移动场曲线

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The mobility of carriers in a silicon surface inversion layer is one of the most important parameters required to accurately model and predict MOSFET device and circuit performance. It has been found that electron mobility follows a universal curve when plotted as a function of an effective normal field regardless of substrate bias, substrate doping (??? 1017 cm???3) and nominal process variations [1]. Although accurate modeling of p-channel MOS devices has become important due to the prevalence of CMOS technology, the existence of a universal hole mobility-field relationship has not been demonstrated. Furthermore, the effect on mobility of low-temperature and rapid high-temperature processing, which are commonly used in modern VLSI technology to control impurity diffusion, is unknown.
机译:载流子在硅表面反转层中的迁移性是准确地模拟和预测MOSFET器件和电路性能所需的最重要的参数之一。已经发现,当绘制为有效正常场的函数时,电子移动性遵循通用曲线,无论衬底偏压如何,衬底掺杂(Δ??1017 cm ??? 3)和标称工艺变化[1]。虽然由于CMOS技术的普遍性,P沟道MOS器件的精确建模变得重要,但尚未证明存在通用空穴移动场关系的存在。此外,对低温和快速高温处理的迁移效果,通常用于控制杂质扩散的现代VLSI技术,是未知的。

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