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A GaAs MMIC-Based Inline RF MEMS Power Sensor

机译:基于GaAs MMIC的内联RF MEMS功率传感器

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In. order to improve microwave characteristics and the frequency response of the output thermovoltage at X-band, an inline RF MEMS power sensor with the impedance matching and compensating capacitance structures is presented in the paper and the sensor is accomplished with GaAs MMIC process. The measured results show that the reflection loss of the sensor is less than -17 dB and the insertion loss is less than 0.8 dB at X-band. A sensitivity of more than 26μV-mW~(-1) and a resolution of 0.316 mW are obtained at 10 GHz. The frequency response of the sensor is relatively flat, and the modulation depth under amplitude modulation (AM) signals influences the output directly. The measured mechanical resonant frequency (f_o) of the MEMS membrane is 110 kHz. In addition, the measured results show that the intermodulation (IM) power for △f = 80 kHz, P_1 = P_2 = 10 dBm of the signals is less than -52 dBm. And the input third-order intermodulation intercept point (IIP3) is a large value at △f=f_o, so the inline RF MEMS power sensor for △f>f_o will not generate significant intermodulation distortion.
机译:在。为了改善X波段的输出热电压的微波特性和频率响应,纸张中提出了具有阻抗匹配和补偿电容结构的内联RF MEMS功率传感器,并且通过GaAs MMIC工艺完成传感器。测量结果表明,传感器的反射损耗小于-17dB,并且插入损耗在X波段处小于0.8dB。在10GHz下获得大于26μV-MW〜(-1)和0.316mW分辨率的敏感性。传感器的频率响应相对平坦,幅度调制下的调制深度(AM)信号直接影响输出。 MEMS膜的测量机械谐振频率(F_O)为110 kHz。另外,测量结果表明,△F = 80kHz的互调(IM)功率,P_1 = P_2 = 10 dBm的信号小于-52dBm。并且输入的三阶互调截距点(IIP3)是△F= f_o的大值,因此△F> f_o的内联RF MEMS功率传感器不会产生显着的互调失真。

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