In this paper the creep behaviour of lead-free hypo-eutectic Sn96.5Ag3.0Cu0.5 solder is evaluated. A series of creep tests at different stress/temperature and strain rate/temperature pairs have been conducted. The tests were observed in-situ with a high magnification camera system. The quantitative data gained from the tests was used to fit an Anand viscoplastic model. Optical observation results are presented from selected tests, showing the occurrence of surface effects such as shear bands, voiding and rumpling. From these observations the main deformation mechanisms were derived and compiled in terms of their dependence of the test conditions.
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