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Comparison of thermal performance between parallel MOSFETs and IPM

机译:平行MOSFET与IPM之间的热性能的比较

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摘要

In this paper, aiming at the heat dissipation problem of power module in miniaturization of motor controller, a parallel MOSFET scheme is designed to replace the integrated module IPM. It is found that the parallel MOSFETs can reduce the heat production of the system, have a smaller heat density, and have better thermal performance. Firstly, the switching time in the motor SVPWM control is analyzed, and the loss calculation method of MOSFET and IPM under different current conditions is introduced in detail. According to the calculated device loss and external heat dissipation conditions, the heat conduction network models of parallel MOSFETs and integrated module IPM are established. The thermal simulation is designed based on ANSYS software. The temperature rise experiment is carried out by means of motor pair dragging. The temperature difference between them is compared under the conditions of 100V DC bus voltage and 30A output current. The simulation and experimental results show that the thermal performance of the motor controller can be effectively improved by using the parallel MOSFET scheme under the same control effect and control ability. This provides technical support for Reliability Application of miniaturization of motor controller.
机译:在本文中,针对电动机控制器小型化电力模块的散热问题,并行MOSFET方案旨在更换集成模块IPM。结果发现,并联MOSFET可以减少系统的热量生产,具有较小的热密度,具有更好的热性能。首先,分析了电动机SVPWM控制中的开关时间,并详细介绍了不同电流条件下MOSFET和IPM的损耗计算方法。根据计算的设备丢失和外部散热条件,建立了并联MOSFET和集成模块IPM的热传导网络模型。热仿真是根据ANSYS软件设计的。通过电动机对拖动进行温度升温实验。在100V直流母线电压和30A输出电流的条件下比较它们之间的温差。模拟和实验结果表明,通过在相同的控制效果和控制能力下使用并联MOSFET方案,可以有效地提高电动机控制器的热性能。这为电机控制器小型化的可靠性应用提供了技术支持。

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