首页> 外文会议>Electron Devices Meeting, 1995., International >Numerical simulation of the temperature dependence of band-edgephotoluminescence and electroluminescence in strained-Si1-xGex/Si heterostructures
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Numerical simulation of the temperature dependence of band-edgephotoluminescence and electroluminescence in strained-Si1-xGex/Si heterostructures

机译:带边温度依赖性的数值模拟Si 1-x Ge中的光致发光和电致发光 x / Si异质结构

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The temperature dependence of band-edge photoluminescence (PL) andelectroluminescence (EL) of Si1-xGex/Siheterostructures was simulated using a two-carrier device simulator. Thedevice simulator was used to determine electrically and opticallyexcited carrier profiles, from which light emission was computed. Thesimulations confirmed an earlier result that PL intensity at hightemperature (>150 K) is controlled by surface recombination.Furthermore, it was found that the difference in measured temperaturedependence between PL and EL experiments is due to (i) the ELexperiments being performed at a much higher total injection rate and(ii) the heavily doped, buried contact layers in EL structures (p-i-ndiodes) effectively blocking carriers from diffusing into the substrateand away from the Si1-xGex layer
机译:带边光致发光(PL)和 Si 1-x Ge x / Si的电致发光(EL) 异质结构是使用两载流子设备模拟器进行模拟的。这 设备模拟器用于确定电学和光学 激发的载流子轮廓,从中可以计算出光发射。这 模拟证实了较早的结果,即高PL强度 温度(> 150 K)通过表面重组来控制。 此外,发现测量温度的差异 PL和EL实验之间的依赖性是由于(i)EL 以更高的总注入速率进行实验,并且 (ii)EL结构中的重掺杂掩埋接触层(p-i-n 二极管)有效地阻止载流子扩散到基板中 并远离Si 1-x Ge x

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