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Defect generation in ultra-thin oxide over large fluence range

机译:大注量范围内的超薄氧化物中的缺陷产生

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The defect generation rate (Pg) during constant voltage stress is investigated by using short-time voltage pulses over large fluence range. It is found that Pg is not constant as a function of injected charge and the voltage acceleration of Pg in the linear defect generation regime is similar to that of the reciprocal of QBD. The change of carrier capture cross (σ) during defect generation was speculated as one of the reasons responsible for the change of the Pg value with injected charge. However, from this preliminary report, we have determined that the change of Pg can not be explained by a change of σ.
机译:通过使用大通量范围内的短时电压脉冲,研究了恒定电压应力下的缺陷产生率(P g )。结果发现,P g 随注入电荷的变化不是恒定的,并且线性缺陷产生机制中P g 的电压加速度与P g 的倒数相似。 Q BD 。推测缺陷产生过程中的载流子俘获叉(σ)的变化是注入电荷导致P g 值变化的原因之一。但是,根据这份初步报告,我们确定P g 的变化不能用σ的变化来解释。

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