Lead is becoming an increasingly unwanted material due to itstoxic qualities. The objective of this study is to find out if analternative lead-free solder technology can be recommended given the LCAknowledge we have today. Conductive adhesive is chosen as alternative totin-lead solder. The result depends entirely on how the environmentalloads from production of silver, tin and lead are divided between thesemetals since in many cases they are produced simultaneously. Further,the environmental effects of silver, tin and lead waste are veryuncertain. Therefore, it cannot be determined whether tin-lead solder orconductive adhesive is the best environmental alternative
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