Contributions on low-cost μBGA soldering/re-soldering methods

摘要

The μBGA soldering process is usually performed in special soldering equipment, under extreme conditions of humidity and temperature. The re-working process of such devices is not recommended due to the complex equipment needed for de-soldering and re-soldering of μBGA capsules. However, the rapid prototyping process of electronic modules sometimes calls for some "home-made" methods to re-work the μBGA capsules. The paper proposes a low-cost solution for μBGA soldering/re-soldering process by using mostly common tools for re-working. The main topics covered by the paper are: balls array growth/re-growth process, hand soldering/re-soldering of μBGA capsules, tips on oven soldering/re-soldering of μBGA modules, testing the μBGA soldering and humidity cautions on μBGA soldering. The paper also proposes a new method of calibration for the soldering temperature of a small oven.