首页> 外文会议>Indium Phosphide and Related Materials, 1992., Fourth International Conference on >In situ selective area etching and MOVPE regrowth of GaInAs-InP onInP substrates
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In situ selective area etching and MOVPE regrowth of GaInAs-InP onInP substrates

机译:GaInAs-InP的原位选择性区域刻蚀和MOVPE再生长。InP基板

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The authors present a method for selective in situ etching andregrowth in open stripes in SiO2 covered InP-substratesinside a MOVPE (metal-organic vapor-phase epitaxy) reactor. The etchingmedium was PCl3, which was dissociated inside the MOVPEreactor at temperatures between 350 and 580° C. The technique usedprovides a smooth and homogeneous surface morphology and exactlycontrollable etching rates down to a few nanometer. This enables theintegration, of an etching and regrowth step in one process withouttransferring the wafer from one machine to another, thus avoidingcontamination of a well-prepared surface just before the epitaxial step.At certain etching rates V-grooves can be obtained and regrown with anInP/GaInAs heterostructure; this is a very promising possibility for insitu growing of quantum wires. The authors investigated the morphologyof the etched substrates with respect to etching temperature and thecrystallographic orientation of the stripes by optical microscopy andscanning electron microscopy. First experiments on in situ etched andregrown V-grooves have been done
机译:作者呈现了一种用于选择性地蚀刻的方法 SiO 2 覆盖的INP基板中的开放条纹中的再生 在MOVPE(金属 - 有机气相外延)反应器内。蚀刻 培养基是PCL 3 ,它在MOVPE内解离 反应器在350至580℃之间的温度下的技术 提供平滑且均匀的表面形态,完全 可控的蚀刻率降至几纳米。这使得这使得 集成,在一个过程中蚀刻和再生步骤 将晶片从一台机器转移到另一台机器,从而避免 在外延步骤之前,污染了良好的表面。 在某些蚀刻速率下,可以获得V形槽并再次再次进行再生 INP / GAINAS异质结构;这是一个非常有希望的可能性 原位生长量子线。作者研究了形态学 相对于蚀刻温度和蚀刻的基材的蚀刻基材 通过光学显微镜和晶体的晶体取向 扫描电子显微镜。第一个实验原位蚀刻和 重新完成了V-Groves

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