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InGaAs-on-Insulator MOSFETs Featuring Scaled Logic Devices and Record RF Performance

机译:具有缩放逻辑器件并记录RF性能的InGaAs绝缘体上MOSFET

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We demonstrate scaled InGaAs-on-insulator FinFETs and planar MOSFETs on Si substrate for low power logic and RF applications. This Si-CMOS compatible technology implements SiNx source-drain spacers and doped extensions for reduced overlap capacitances. FinFETs with performance for logic applications matching state-of-the-art are demonstrated. Simultaneously, ft and fmax of 400 and 100 GHz are achieved respectively, the highest reported ft for a III-V MOSFET on Si. Finally, we explore the use of an extended gate line to reduce gate resistance, offering balanced ft/fmax of 215/300 GHz, the first report of III-V RF devices on Si matching state of the art Si-CMOS.
机译:我们在Si衬底上展示了缩放的IngaAs-on绝缘体FinFET和平面MOSFET,用于低功耗逻辑和RF应用。这种SI-CMOS兼容技术实施了罪恶 x 源排水垫片和掺杂的延伸部,用于减少重叠电容。展示了符合最先进的逻辑应用性能的FinFET。同时,F. t 和F. max 400和100 GHz分别取得最高报告的F. t 对于SI的III-V MOSFET。最后,我们探讨了扩展栅极线来降低栅极电阻,提供平衡f t /F max 215/300 GHz,III-V RF器件的第一个关于SI-CMOS的SI匹配状态的第一个报告。

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