Indirect contact probing method for characterizing via arrays in electronic packaging

摘要

In this paper, an indirect contact probing method for via arrays is proposed. The proposed method characterizes via arrays without contact damage from probe tips, and it does not require additional control and sensor electronics. To execute the indirect contact method, firstly, multiple measurements on specially designed calibration vias are performed to obtain the dielectric contactor characteristic. The characterized contactor layer is de-embedded when the actual via arrays as the device-under-tests (DUTs) are extracted. In simulations at frequencies ranging from 800 MHz to 25 GHz, it is confirmed that defects on via arrays can be successfully identified from the indirect-contact probing.