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Pure Play GaN Foundry 0.25µm HEMT Technology for RF Applications

机译:用于射频应用的Pure Play GaN铸造厂0.25µm HEMT技术

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This paper presents the development of a newly available short gate length 0.25μm GaN HEMT technology and focuses on fabrication, process control, RF characterization and DC reliability. Our pure play Foundry services support discrete and RF applications with detailed specifications and wafer acceptance tests. The analysis of load-pull measurements of S- through X-band and DC reliability allow designers to create applications utilizing supply voltages up to 28V, with power density of 4W/mm, PAE of 45%, and large signal linear gain of 15dB at 10GHz based on continuous-wave on-wafer measurements without harmonic terminations. Improved power density of >5W/mm, PAE of 57.3% and linear gain of 20.1dB at S-band are measured under pulsed conditions using a 2.5μsec pulse at 1% duty cycle. Reliability performances focused on HTOL and HTRB are presented.
机译:本文介绍了一种新型的,栅极长度短的0.25μmGaN HEMT技术的开发,重点是制造,过程控制,RF表征和DC可靠性。我们的纯晶圆厂服务具有详细的规格和晶圆验收测试,支持离散和RF应用。通过分析S到X波段的负载拉力测量结果以及DC可靠性,设计人员可以利用高达28V的电源电压创建应用,功率密度为4W / mm,PAE为45%,大信号线性增益为15dB。基于连续波晶圆上测量的10GHz,无谐波终端。在1%占空比下使用2.5μsec脉冲的脉冲条件下,在S波段测量了大于5W / mm的改进功率密度,57.3%的PAE和20.1dB的线性增益。给出了针对HTOL和HTRB的可靠性性能。

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