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High Tensile Strained In-Situ Phosphorus Doped Silicon Epitaxial Film for nMOS Applications

机译:用于nMOS应用的高拉伸应变原位掺杂磷的硅外延膜

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In-situ phosphorus doped silicon epitaxial film with 2.8 × 10~(21)cm~(-3)doping level is found to show high tensile stress comparable tocarbon doped silicon with 1.8% substitutional carbon. As-grownsamples show electrically activated dopant concentration of lessthan 2 × 10~(20) cm~(-3). The high tensile and low activation could bewell explained by formation of a pseudocubic Si_3P_4 structure insilicon lattice. Film resistivity of 0.29 mOhm-cm could be obtainedwith 0.25 ms annealing at 1200 °C, with slight reduction in tensilestrain. Also, 0.23 mOhm-cm could be obtained by millisecondanneal at 1300°C, but with 30% reduction in tensile strain.
机译:2.8×10〜(21)cm〜(-3)的原位掺磷硅外延膜 发现掺杂水平显示出可与之媲美的高拉伸应力 碳掺杂的硅具有1.8%的替代碳。成年 样品显示电激活的掺杂剂浓度低于 大于2×10〜(20)cm〜(-3)高拉伸和低活化可能是 通过伪立方Si_3P_4结构的形成很好地解释了 硅晶格。可获得0.29 mOhm-cm的膜电阻率 在1200°C下进行0.25 ms退火时,拉伸强度略有降低 拉紧。另外,毫秒可以得到0.23 mOhm-cm 在1300°C退火,但拉伸应变降低了30%。

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