首页> 外文会议>Indium Phosphide and Related Materials, 1995. Conference Proceedings., Seventh International Conference on >Effect of strained interfacial layer and large misorientation onSQW, 2DEG, and multisteps in InGaP/(In)GaAs heterostructures grown byMOVPE
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Effect of strained interfacial layer and large misorientation onSQW, 2DEG, and multisteps in InGaP/(In)GaAs heterostructures grown byMOVPE

机译:界面层张紧和大的取向错误的影响SQW,2DEG和InGaP /(In)GaAs异质结构中的多步生长电影

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We studied 2DEG performance in Si-doped (including heavilyplanar-doped) InGaP/GaAs heterostructures. We found that Si diffusedfrom InGaP to GaAs, and an In0.3Ga0.7P (not GaP)interfacial layer between the Si-doped layer and the channel layer isoptimum for high 2DEG performance. Step bunching due to misorientationis an interesting issue in MOVPE. We studied a misorientation effect andfound that large misorientation over 10° from (001) improves the SQWquality without inserting a GaP layer at the interface. We also foundthat the performance of InGaP-based HEMTs (including inverted-type) isnot linked with the SQW quality, and that misorientation towards<111>A is required for high mobility. We characterized multistepsusing atomic force microscopy (AFM) and concluded that the multistepconfiguration mainly affects abruptness in device structures
机译:我们研究了掺Si(包括重掺杂)中的2DEG性能 平面掺杂)InGaP / GaAs异质结构。我们发现Si扩散了 从InGaP到GaAs,以及In 0.3 Ga 0.7 P(不是GaP) 硅掺杂层与沟道层之间的界面层为 最适合2DEG高性能。由于方向错误而导致的步骤聚束 在MOVPE中是一个有趣的问题。我们研究了取向错误的影响, 发现从(001)起超过10°的大方向偏差会改善SQW 质量,而无需在接口上插入GaP层。我们还发现 基于InGaP的HEMT(包括倒置型)的性能为 与SQW的质量无关,并且对 <111> A是高移动性所必需的。我们表征了多步骤 使用原子力显微镜(AFM)得出的结论是,多步骤 配置主要影响设备结构的突然性

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