Millimeter-wave monolithic GaAs IC interconnect and packagingtechnology trends in Japan

摘要

This paper presents an overview of recent technology trends ofmillimeter-wave MMIC interconnect and packaging in Japan in the aspectsof low cost and high productivity. Ceramic-base packages up to W-band,flip-chip bonding and packaging for low cost and high productivityassembling, and 3D MCM technology for low cost and high functionality,have been developed