Millimeter-wave monolithic GaAs IC interconnect and packaging technology trends in Japan

摘要

This paper presents an overview of recent technology trends of millimeter-wave MMIC interconnect and packaging in Japan in the aspects of low cost and high productivity. Ceramic-base packages up to W-band, flip-chip bonding and packaging for low cost and high productivity assembling, and 3D MCM technology for low cost and high functionality, have been developed.