SURFACE MOUNTABLE INTEGRATED CIRCUIT PACKAGING SCHEME, WHICH INCLUDES A MONOLITHIC MICROWAVE INTEGRATED CIRCUIT AND THE ARRAY OF MILLIMETER-WAVE ANTENNA

摘要

PURPOSE: A surface mountable integrated circuit packaging scheme is provided to form highly integrated millimeter-wave package by forming a multi-layered substrate which includes an antenna array and a monolithic microwave integrated circuit.;CONSTITUTION: A first set, a second set and a third set of one or more layers form a substrate(160). The array of millimeter-wave antennas(170) is arranged on the first set of one or more layers. A monolithic microwave integrated circuit(145) is arranged on the third set of one or more layers. An antenna supply point(165) is arranged on the second set of one or more layers. An interconnection unit transmits signal from the monolithic microwave integrated circuit to the antenna supply point. Leads are arranged on the third set of one or more layers in order to mount the substrate to a printed circuit board.;COPYRIGHT KIPO 2010