Board level reliability of tin-lead plated and hot solder coatedlead finishes as a function of solderability

摘要

The board-level solder joint reliability of plastic surface-mountcomponents was evaluated by temperature cycling plastic leaded chipcarrier (PLCC) and plastic quad flatpack (PQFP) components. Reliabilitywas assessed by using T/C `C' (-65° C to +150° C for a 30-minperiod) conditions. Acceptable reliability was obtained for allcomponents which met current solderability requirements. Onlysolderability specimens which would have failed standard visualinspection exhibited unacceptable levels of cracking after exposure toT/C `C' conditions. Both 85%-tin-15%-lead solder plated finish and63%-tin-37%-lead hot solder coated components are evaluated