METHOD FOR MANUFACTURING HOT SOLDER AIR LEVELING FOR MODULE PRINTED CIRCUIT BOARD WITH AUTOMATIC STOP SENSOR AND APPARATUS THEREOF

摘要

Purpose: a kind of method, the regular quality or accumulation that a hot solder block level and its device for manufacturing the module printed circuit board for being used to have an autostop sensor prevent PCBs bendings from being arranged to one printed circuit board of realization by using a sensor detecting/controlling product speed. A kind of construction: method; a hot solder block level for manufacturing the module printed circuit board for being used to have an autostop sensor uses the step for stopping at a substrate of side for a machine; it is used to coat solder and passes through the blowing in the upper and lower surfaces of substrate while cooling down substrate to prevent PCBs from being bent, due to a difference of the cooling rate between upper and lower surfaces.