HOT-GAS SOLDER LEVELING ON PRINTED CIRCUIT BOARDS

摘要

Hot-gas solder leveling on printed circuit boards produces a more uniform coating in the plated-through holes than other methods, while achieving an acceptable leveling of the lands. The amount of thermal degradation to the printed circuit board by the leveling process is reduced.nThe working environment of the leveling machine is improved by eliminating the contaminating vapors.