A study on the effectiveness of dummy pattern design existence inmulti-layer PBGA application

摘要

In this paper, we will report our recent study results on thedummy pattern design effectiveness in multi layer PBGA (Plastic BallGrid Array) packages focusing on final product quality of thesemiconductor package. Until now, there is no experimental and empiricalassessment on the effectiveness of dummy pattern existence which givesus the solid conviction in applying this concept in a high volumemanufacturing scale in the PBGA industrial arena. This paper shows thedetailed evaluation and experimental result with various design conceptsof dummy patterns in multi layer PBGA substrates. From the thicknessvalidation with same substrate manufacturing condition, to the overallPBGA package performance validation will be covered in this paper. Ballcoplanarity and substrate thickness variation data will be reported withanalytical simulation result