Electronic packaging and interconnection techniques, education atuniversity level-a Romanian experience

摘要

The paper presents the ten years experience in the field ofuniversity education/training of Romanian students and specialists forthe benefit of electronic packaging development and dissemination. Themain activities developed in CETTI, a small packaging research center,part of “Politehnica” University of Bucharest, are focusedon modules and assemblies. The orientation of CETTI in electronicpackaging and interconnection techniques started many years ago.Regarding CAE-CAD-CAM, this teaching direction was developed in 1992.Companies and professional associations such as ARIES (RomanianAssociation for Electronics Industry and Software), IEEE-CPMT, IMAPS,and IEEE Romanian Section have understood the importance of universitylevel practice oriented education, training laboratories and engineeringcooperation. CETTI, through its scientific/technical seminars andworkshops, clusters professors, students and specialists from researchcompanies interested in electronic assemblies development and offerssolid bridges between academia and enterprises. Every year, CETTIorganizes “Interconnection Techniques in Electronics”, TheRomanian Inter-University Professional Student Contest in the Field ofPrinted Circuit Board Design. At the last edition (TIE 2000) more than70 participants were present at start