There has long been a need for electronics that can operate athigh temperatures. Applications that could make use of 300° Cpackages include deep well drilling sensors and the direct mounting ofpackages to high temperature engines of all types. Only recently have ICchips been developed that can survive continuous operating temperaturesup to 300° C. Unfortunately, current packaging technology cannothandle these high temperatures. This paper will detail a packagingtechnique that will survive continuous operating temperatures up to300° C
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