This paper describes a novel method for densifying the surfaces ofexternal, thick film molybdenum circuit features of multilayer ceramicsubstrates using palladium as a sintering catalyst. Such dense sinteringof the surface effectively prevents the formation of undesirable poolsof glass on the surfaces of the external features, making it possible toperform contact-probe electrical testing prior to plating and to nickelplate the molybdenum features without the customary cleaning stepsneeded to clear the pools of glass
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