Optical interconnects at the multi-chip module level; a view fromthe system level

摘要

To the optical interconnect technologist, there exists a vision ofimplementation of the optical alternative at the multi-chip module (MCM)level. Expressed in its most basic form, the vision is that of a MCMbeing designed at a computer terminal wherein the designer has 10 ormore layers of metal interconnect levels available,and perhaps 2 otherlayers, referred to as “opto” layers (optol, opto2). Theopto layers consist of some electronically compatible dielectric layerthat can be laid down and patterned to form very low-loss opticalwaveguides within the multi-layer MCM structure. These waveguides, andthe associated driver/receiver electronics, have sufficiently superioroptical performance characteristics and sufficiently robustmechanical/thermal properties that implementing them at the MCM levelamounts to straightforward delineation of design rules for the layoutengineer