On-chip piezoresistive stress measurement and 3D finite elementsimulations of plastic DIL 40 packages using different materials

摘要

A full matrix of 8 different configurations of a plastic DIL 40package has been measured. The materials used in the package consistedof a copper or an alloy 42 lead frame, a standard conductive die-attachadhesive or a special low stress type of die-attach adhesive and astandard moulding compound or a low stress compound. The stressmeasurements were performed with a test chip based on the piezoresistiveeffect. The numerical simulations ham been carried out to verify theresults and to gain more insight in the deformations inside the package.Though the results are achieved for an dual in line package some resultswill also be valid for other types of plastic packages