首页> 外文会议>Electronic Components and Technology Conference, 1991. Proceedings., 41st >Advances in high C-V multilayer ceramic chipcapacitors
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Advances in high C-V multilayer ceramic chipcapacitors

机译: C - V 多层陶瓷芯片的研究进展电容器

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It is pointed out that the multilayer ceramic chip capacitor (MCC)has made great strides in the area of package density, described as thecapacitance-voltage (C-V) product divided by the case size. Thishigh-density packaging requirement is manifest in telecommunications,computers, and consumer electronics and other battery-powered products.The increased use of battery-powered products and systems has in turnreduced voltage rating requirements, and therefore allows reduceddielectric thicknesses for MCCCs. The voltage rating for these densemultilayer ceramic chip capacitors was selected at 16 V, to allow for areasonable factor of safety in most battery-powered applications andbecause of its typical rating for tantalum capacitors. This technologyprovides a means for packaging a 16-V, 10-μF capacitor in an EIA 1206(0.120 in×0.060 in) case size
机译:需要指出的是,多层陶瓷贴片电容器(MCC) 在封装密度方面取得了长足的进步,被称为 电容-电压(C-V)乘积除以外壳尺寸。这 高密度包装要求体现在电信中, 计算机,消费类电子产品和其他电池供电的产品。 越来越多地使用电池供电的产品和系统 降低了额定电压要求,因此允许降低 MCCC的介电厚度。这些密集的额定电压 多层陶瓷片状电容器的选择电压为16 V,以允许 大多数电池供电应用中的合理安全系数,以及 由于其对钽电容器的典型额定值。这项技术 提供了一种在EIA 1206中封装16V,10μF电容器的方法 (0.120英寸×0.060英寸)外壳尺寸

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