Chip-scale packaging of power devices and its application inintegrated power electronics modules

摘要

We present a power electronics packaging technology utilizingchip-scale packaged (CSP) power devices to build three-dimensionalintegrated power electronics modules (IPEMs). The chip-scale packagingstructure, termed Die Dimensional Ball Grid Array (D2BGA),eliminates wise bonds by using stacked solder bumps to interconnectpower chips. D2BGA package consists of a power chip, innersolder bumps, high-lead solder balls, and molding resin. It has the samelateral dimensions as the starting power chip, which makes high-densitypackaging and module miniature possible. This package enables the powerchip to combine excellent thermal transfer, high current handlingcapability, improved electrical characteristics, and ultra-low profilepackaging. Electrical tests show that the V_CE(sat) andon-resistance of the D2BGA high speed insulated-gate-bipolartransistors (IGBTs) are improved by 20% and 30% respectively byeliminating the device's wirebonds and other external interconnections,such as the leadframe. In this paper, we present the design,reliability, and processing issues of D2BGA package, and theimplementation of these chip-scale packaged power devices in building 30kW half-bridge power converter modules. The electrical and reliabilitytest results of the packaged devices and the power modules are reported