Comparison of flip chip technologies on rigid polyimide withrespect to reliability and manufacturing costs

摘要

Flip chip interconnect technology has seen extensive growth withthe demands for electronics miniaturization. Applying flip chipinterconnection can potentially achieve smaller size, betterperformance, higher reliability and, with the development of newmaterials and processes, lower cost. In this study, the Space Departmentof the Johns Hopkins University Applied Physics Laboratory is workingjointly with HyComp, and Fraunhofer Institute of Reliability andMicrointegration, to investigate the feasibility and reliability ofseveral types of interconnect technologies for flip chips. Attentionswill be focused on the interconnections between integrate circuits(IC's) and the substrate as they are indicated as weak linkages forlong-term reliability. Emerging interconnect technologies, such asapplying anisotropic conductive adhesive (ACA), Au stud bumping, andStud Bump Bonding (SBB), will be discussed in this paper. All assemblieswill be subjected to series of reliability tests, including temperaturecycling, thermal shock, vibration, 85° C/85% RH temperature humidity,and radiation tests. In-situ resistance measurements will be made tocontinuously monitor performance of interconnects. The test results canbe used to evaluate and assess the reliability of the interconnecttechnology for future space application. Furthermore, a cost comparisonof all investigated technologies will be given in this study. Thus weevaluated not only the technological but also the economical potentialof each technology