Manufacturing productivity improvements for PBGA and flip chipsubstrates in PWB factory

摘要

This paper discusses the new techniques applied to a conventionalPWB manufacturing line to improve productivity and maximize capacity forPBGA and flip chip substrate products. We discuss equipmentmodifications and processing productivity improvements in the areas oftest, handling, panel layout and singulation. The challenge has been tocreate process steps to match specific and sometimes uniquerequirements, which often resulted in sub optimization of the productthrough the factory standard 19.5"×24" panel. Traditional PWB carddimensions range from one up on a standard panel size to cards as smallas 3"×5" repeated within the panel framework. These panels aretypically profiled to final shipped format and do not have symmetricaldimensions. With the industry trends for PBGA and flip chip substratesevolving to higher I/O, less space, chip scale packaging, and largevolumes, productivity has a direct correlation to panel utilization.PBGA sizes, typically square or rectangular, allow for improvedoptimization through the use of processes that are typically seen inwafer and ceramic substrate manufacturing. The singulation and testingequipment required a high degree of cross industry thinking to integrateit within the conventional PWB equipment set. We describe specificchanges to the factory, which includes modified equipment forsingulation and processing. We also describe the advantages andchallenges that each of the improvements has to overall throughput andcost efficiency in the PWB line. Finally we demonstrate how we executedsignificant improvements to the quality and consistency of the finalproduct