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Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers
Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers
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机译:利用分段芯片和/或芯片载体降低倒装芯片PBGA封装中的应力
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摘要
A method and structure to electrically couple a semiconductor device to a substrate that is divided into a plurality of segments. Alternatively, a semiconductor device may be divided into a plurality of segments and the plurality of segments are electrically coupled to a single substrate.
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