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Logic State Imaging From FA Techniques for Special Applications to One of the Most Powerful Hardware Security Side-Channel Threats

机译:逻辑状态成像,从用于特殊应用的FA技术到最强大的硬件安全性边通道威胁之一

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Contactless Fault isolation (CFI) techniques of Microelectronic Debug and Failure Analysis (FA) are developed for the identification of anomalies. If not only anomalies can be detected but also regular logical functionality, the contactless approach opens up a path to hardware security attacks. Logical state information is typically more complicated to detect than anomalies, as the signal level is usually considerably smaller. Successful Logic State Imaging (LSI) has been published in the FA community using specific derivatives of photon emission (PE) and laser-based CFI techniques. This work investigates how the contactless LSI techniques can be used for reading sensitive data out of security-relevant circuitry. The qualification of PE, Thermal Laser Stimulation (TLS), and Laser Logic State Imaging (LLSI) to read out Static Random-Access Memory (SRAM) and battery-backed RAM (BBRAM) cells is demonstrated in two case studies. LLSI offers perspectives for low voltage technologies and feature size resolution by possibly expanding into the visible spectral regime. Therefore, the security risk for some technology generations to come will stay. Furthermore, when considering the use of artificial intelligence, CFI techniques can reach new dimensions of tracking sensitive on-chip data with unimagined consequences for security applications
机译:开发了微电子调试和故障分析(FA)的非接触式故障隔离(CFI)技术来识别异常。如果不仅可以检测到异常,还可以检测到常规的逻辑功能,则非接触式方法将为硬件安全攻击开辟一条道路。逻辑状态信息通常比异常要复杂得多,因为信号电平通常要小得多。成功的逻辑状态成像(LSI)已在FA社区中发布,使用了光子发射(PE)的特定衍生物和基于激光的CFI技术。这项工作研究了如何将非接触式LSI技术用于从与安全性相关的电路中读取敏感数据。在两个案例研究中,证明了PE,热激光刺激(TLS)和激光逻辑状态成像(LLSI)可以读取静态随机存取存储器(SRAM)和电池供电的RAM(BBRAM)单元的资格。 LLSI可能会扩展到可见光谱范围,从而为低电压技术和特征尺寸分辨率提供了前景。因此,未来几代技术的安全风险将继续存在。此外,当考虑使用人工智能时,CFI技术可以达到跟踪敏感的片上数据的新维度,从而对安全应用产生无法想象的后果

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