Development of Directly Liquid Cooled Integrated Substrate for Power Modules

摘要

The authors succeeded in high level integration of a metal ceramics substrate, a heat sink base plate and a cooler with cooling fins by investigation of appropriated materials, bonding methods and structures. This results in the directly liquid cooled Integrated Substrate which offers features of high-power density, high reliability and low weight. Moreover, according to the component integration and the elimination of thermal interfaces within the power module, cost for assembling could be significantly decreased.