Fluid-cooled power module contains encapsulation frame in which semiconductor substrate is fitted directly on cooling body containing fluid chamber through which cooling fluid flows

摘要

The fluid-cooled power module (50) contains an encapsulation frame (31) in which a semiconductor substrate (43) is fitted directly on a cooling body (51). One or more semiconductor substrates are soldered to the cooling body. The cooling body is produced in one piece and comprises a straight, parallel-running tube (44).