Using Destructive Testing Methods, X-Ray Diffraction and Logic Analysis to Control Operation of Integral Circuits

摘要

The paper consists of four sections: the first section contains the description and characteristics of destructive testing methods; the second section contains hardware backdoor detection using the X-ray analysis method; the third section highlights experimental application of electronic microscopy to analyze the surface topology of integral circuit; the fourth section describes the use of a readback function to restore the chip configuration. The correct implementation of destructive testing helps to get sequence of layer deposition and their thickness that can be used in recovery of topology circuit. The X-ray methods of analysis are basic and mostly common at testing printed circuit boards for the presence of third-part inclusions. The logical analysis theoretically makes it possible to get all signal values, obtained from an integral circuit, which can be used in logical testing and hardware information protection.