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Ferroelectric Aluminum-Doped Hafnium Oxide for Memory Applications

机译:铁电铝掺杂氧化铪用于内存应用

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Ferroelectric complex perovskites, such as lead zirconate titanate (PZT), strontium bismuth tantalate (SBT), and lead magnesium niobate-lead titanate (PMN-PT) have been widely used in ferroelectric devices. However, these traditional ferroelectric materials have a limitation in thickness scaling and are incompatible with CMOS processes. In the last few years, doped metal oxides, including hafnium oxide (Hf02) and zirconium oxide (ZrO2), were found to have ferroelectric phase [1]–[2]. Ferroelectric HfO2has the advantages of a high coercive field, excellent scalability (down to 2.5nm), and good compatibility with CMOS processing [3]–[7]. In this paper, we systematically investigate Al-doped HfO2with various electrodes, Al compositions and annealing temperatures. We found that Ti/Pd is a promising candidate as top electrode material for ferroelectric HfO2.
机译:在铁电器件中广泛应用于铁电器件的铁电器件,如铅锆钛酸铅(PZT),锶铋(SBT)和铅镁铌酸铅(PMN-PT)的铁电复合钙酸盐。然而,这些传统的铁电材料具有厚度缩放的限制,并且与CMOS工艺不相容。在过去几年中,掺杂的金属氧化物,包括氧化铪(HF0 2 )和氧化锆(Zro 2 ),被发现具有铁电相[1] - [2]。铁电hfo. 2 具有高矫顽领域的优点,可扩展性优异(低至2.5nm),与CMOS处理良好兼容[3] - [7]。在本文中,我们系统地研究了al-掺杂的HFO 2 具有各种电极,Al组合物和退火温度。我们发现TI / PD是一个有希望的候选者作为铁电HFO的顶部电极材料 2

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