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The study of low frequency noise of single-walled carbon nanotube transistors

机译:单壁碳纳米管晶体管低频噪声的研究

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Nano-scale single-walled carbon nanotube (SWNT) FETs with near ballistic electron and hole transport have attracted interest for potential application in ultra large scale integrated circuits. In addition to immature fabrication technology, hysteresis in the IV characteristics and reported large amplitudes of low frequency noise of SWNT-FETs have impeded their implementation into electronic and sensing systems [1-3]. In this paper, we report a top gate SWNT-FET with reduced hysteresis in the IV characteristics and extremely low 1/f noise. We have also investigated the source of 1/f noise in these devices and attributed the low noise property to low trap charges near the carbon nanotube substrate interface. The SWNT-FET devices reported here and shown schematically in Fig.1(a), are fabricated on high resistivity Si substrate (ρ≈10KΩ) with a 500nm thermal SiO{sub}2. Catalyst patterns are defined by UV photolithography with a 10μm spacing and subsequent iron deposition and lift-off. Single-walled carbon nanotubes (SWNTs) are then synthesized by chemical vapor deposition (CVD) of methane on the substrate using iron catalyst. Source-drain contacts are formed by electron beam deposition of Pd metal. A 20nm high-k HfO{sub}2 film is deposited at 300°C by using HfCl{sub}4 and H{sub}2O precursors in an ASM Microchemistry F-120 ALCVD Reactor. Carbon nanotubes are bridged between source and drain as shown in Fig.1(b). Top Gate metal is defined by UV photolithography followed by the deposition of Cr/Au (10/50nm) with minimum gate length of 1.5μm. Cr/Au (20/450nm) metal interconnects are finally deposited on top of the source and drain Pd contacts.
机译:纳米级单壁碳纳米管(SWNT)FET具有近乎弹道电子和空穴传输的FET引起了对超大型集成电路中的潜在应用的兴趣。除了不成熟的制造技术之外,IV特性中的滞后并报告了SWNT-FET的大频率噪声的大幅度已经阻碍了它们的电子和传感系统[1-3]。在本文中,我们报告了一个顶级栅极SWNT-FET,IV特征中具有降低的滞后和极低的1 / F噪声。我们还在这些装置中调查了1 / F噪声的来源,并将低噪声属性归因于碳纳米管基板界面附近的低陷阱电荷。这里报道的SWNT-FET器件在图1(a)中示意性地示出,在高电阻率Si衬底(ρ≈10kΩ)中,具有500nm热SiO {sub} 2。催化剂图案由UV光刻限定,具有10μm间距和随后的铁沉积和剥离。然后使用铁催化剂通过甲烷上的甲烷的化学气相沉积(CVD)合成单壁碳纳米管(SWNT)。通过PD金属的电子束沉积形成源极排出触点。在ASM微型化学F-120 ALCVD反应器中使用HFCL {Sub} 4和H {Sub} 2O前体,在300℃下沉积20nm高-kHFO {Sub} 2膜。如图1(b)所示,碳纳米管在源极和排水管之间桥接。顶栅金属由UV光刻法定义,然后沉积Cr / Au(10 / 50nm),最小栅极长度为1.5μm。 Cr / Au(20 / 450nm)金属互连最终沉积在源极和排水PD触点的顶部。

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