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Experimental calibration of the temperature dependence of the heterojunction bandgap in III-V tunneling devices

机译:III-V隧穿器件中异质结带隙的温度依赖性的实验校准

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The capability to achieve sub-60 mV / dec subthreshold swings through quantum mechanical (QM) band-to-band tunneling (BTBT) has established the tunnel field-effect transistor (TFET) as an important candidate to drive future ultra-low power logic applications [1], [2]. Currently, most state-of-the-art TFET devices use III-V compounds as their active region material [3]-[5]. This is motivated by the direct nature of their bandgap and the possibility to combine two different materials in a heterostructure configuration to obtain a small effective bandgap Eg,eff at the the heterojunction. However, the temperature dependence of the effective bandgap and how it relates to the constituent compound materials has not yet been resolved. In this work, we calibrate the temperature dependence of the effective bandgap of a GaAs0.5Sb0.5(GAS)/In0.53Ga047 As (IGA) heterostructure using the current-voltage characteristics of a p-i-i-n GAS/IGA heterostructure Esaki diode [6], and we present calibrated temperature-dependent TFET predictions.
机译:通过量子机械(QM)带对隧道(BTBT)实现低于60 mV / dec亚阈值摆幅的能力已将隧道场效应晶体管(TFET)确立为驱动未来超低功耗逻辑的重要候选者应用[1],[2]。当前,大多数最先进的TFET器件都使用III-V化合物作为其有源区材料[3]-[5]。这是由于其带隙的直接性质以及将两种不同材料以异质结构配置结合以获得较小的有效带隙E的动力所致 g,eff 在异质结处。然而,有效带隙的温度依赖性及其与组成化合物的关系如何尚未得到解决。在这项工作中,我们校准了GaAs有效带隙的温度依赖性 0.5 0.5 (GAS)/输入 0.53 047 作为(IGA)异质结构,使用p-i-i-n GAS / IGA异质结构Esaki二极管的电流-电压特性[6],我们提出了校准的温度相关TFET预测。

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