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Improved performance of chemo-mechanical polishing CMP processes through targeted adjustment of polishing slurry and polishing pad

机译:通过有针对性地调整抛光液和抛光垫,改善化学机械抛光CMP工艺的性能

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Chemical-mechanical polishing (CMP) of optical glasses is widespread and forms the basis for many high-precision polishing processes. The pads, slurries and glass materials used in polishing have many different properties. The effects of these properties on the process results are often unknown. The right choice and combination is therefore often a challenge. By means of a plan processing of N-BK.7 and SF56 samples by a plan-polishing process, the influence on the process results, material removal rate (MRR), micro roughness and cleanliness caused by slurry and polishing pad is shown. It turns out that the type of polish pad has the biggest impact on the results. The easy-to-process material N-BK.7 shows only little influence by the type of slurry used. The more challenging SF56, however, shows significant effects, especially in the area of the resulting micro roughness and the appearance of surface damages like orange peel. Especially the use of Auerpol® PZ500 shows clear advantages here. For a selection of three out of nine polishing pads, the effect of density variation of the slurry was also investigated. Lower particle concentrations lead to lower material removal rates. This applies to both materials. The more sensitive SF56 shows a reduction in micro roughness by the use of a less dense slurry. The correct selection of the polishing pad has a positive effect on the material removal rate and/or the micro roughness in all tested materials. An adaptation of the type and concentration of the slurry is especially important for more sensitive materials and in combination with the right polishing pad. In view of the development towards special materials and small lot sizes, the targeted and correct selection of polishing slurries and pads becomes more and more important. The information required for this purpose on the behavior of the pads and slurries available on the market must therefore first be determined in a targeted manner and clearlv presented.
机译:光学玻璃的化学机械抛光(CMP)已广泛使用,并构成了许多高精度抛光工艺的基础。用于抛光的垫,浆料和玻璃材料具有许多不同的特性。这些属性对过程结果的影响通常是未知的。因此,正确的选择和组合通常是一个挑战。通过使用平面抛光工艺对N-BK.7和SF56样品进行平面处理,显示了对工艺结果,材料去除率(MRR),微观粗糙度和清洁度的影响,这些影响是由浆料和抛光垫引起的。事实证明,抛光垫的类型对结果的影响最大。易于处理的材料N-BK.7仅受所用浆料类型的影响很小。但是,更具挑战性的SF56表现出显着的效果,尤其是在产生的微粗糙度和表面损伤(如桔皮)外观方面。特别是Auerpol®PZ500的使用在这里显示出明显的优势。为了从九个抛光垫中选择三个,还研究了浆料密度变化的影响。较低的颗粒浓度导致较低的材料去除率。这对两种材料都适用。 SF56敏感性更高,通过使用密度较小的浆料可以降低微观粗糙度。正确选择抛光垫会对所有测试材料的材料去除率和/或微观粗糙度产生积极影响。对于更敏感的材料并与正确的抛光垫结合使用,浆液类型和浓度的调整尤为重要。鉴于向特殊材料和小批量的发展,有针对性地和正确地选择抛光浆和抛光垫变得越来越重要。因此,必须首先以针对性的方式确定并明确显示为此目的所需的关于市场上可买到的垫和浆料的性能的信息。

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