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Study on flawed surface of GaAs epitaxial wafer in the process of wet chemical etching

机译:湿法化学刻蚀过程中GaAs外延片缺陷表面的研究

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The flawed surface of GaAs/GaAlAs heterointerface after wet etching by H_2O_2 and NH_4OH based etch ant was studied in this work. The results showed that the surface of GaAs/GaAlAs heterointerface had convex point, etching pits, pinhole, fog point, and friction scratches were investigated with a etch step measurement. And imprinting the main reasons for the formation of the etching surface defects of GaAs/GaAlAs are the poor quality of epitaxial materials, the contamination of materials surface, the unclear interface of oxidation and doping, the inhomogeneity of concentration and the operation errors. The selective etching of the GaAs/GaAlAs material eliminates some flaws and improves the quality of the etching surface of the GaAs/GaAlAs material.
机译:研究了H_2O_2和NH_4OH基刻蚀剂湿法刻蚀后GaAs / GaAlAs异质界面的缺陷表面。结果表明,GaAs / GaAlAs异质界面表面具有凸点,刻蚀点,针孔,雾点和摩擦划痕,并通过刻蚀步长进行了研究。造成GaAs / GaAlAs刻蚀表面缺陷形成的主要原因是外延材料质量差,材料表面污染,氧化和掺杂界面不清楚,浓度不均匀以及操作错误。 GaAs / GaAlAs材料的选择性蚀刻消除了一些缺陷并提高了GaAs / GaAlAs材料的蚀刻表面的质量。

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